CANBY, OR – In the assembly world, putting vias directly in surface mount pads is often not recommended. But for routing large or fine-pitch BGAs, bypass capacitors, thermal management, and grounding on high-frequency parts, via-in-pad can be an effective, if demanding, solution.

Just how and when to choose the method is the focus of a new white paper, Via in Pad Guidelines, by Duane Benson of Screaming Circuits. For a copy, visit or email This email address is being protected from spambots. You need JavaScript enabled to view it..
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