The MultiPress S is a microprocessor-controlled bench-top
multilayer lamination press said to be ideal for creating multilayer circuit
boards. Is said to be a tool for rapid PCB prototyping, with a pressing time of
fewer than 90 min. Bonds multilayer circuits of all common rigid and flexible
substrates. Delivers equal pressure on the full press plate area. Nine
heating/pressing/cooling process profiles can be programmed into the system,
with a max. press area of 9" x 12" and temp. up to 482 °F (250 °C);
can bond RF-multilayer substrates.
LPKF, www.lpkfusa.com