The MultiPress S is a microprocessor-controlled bench-top multilayer lamination press said to be ideal for creating multilayer circuit boards. Is said to be a tool for rapid PCB prototyping, with a pressing time of fewer than 90 min. Bonds multilayer circuits of all common rigid and flexible substrates. Delivers equal pressure on the full press plate area. Nine heating/pressing/cooling process profiles can be programmed into the system, with a max. press area of 9" x 12" and temp. up to 482 °F (250 °C); can bond RF-multilayer substrates.

LPKF, www.lpkfusa.com 

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