Ansys 2021 R2 increases data visibility and reuse for materials, digital twin components, electronic components and compliance initiatives. Productivity enhancements perform optical simulation meshing up to 20X faster and local meshing up to 100X faster. New Phi Plus mesher meets 3-D integrated circuit package challenges by accelerating initial meshing for bondwire package electromagnetics and signal integrity analysis by an average of 6-10X. New chip-package-system (CPS) and printed circuit board (PCB) enhanced workflows with automation for IC-on-package and multi-Zone PCBs with rigid-flex cables.


Ansys 2021 R2-web

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