Material Selection for High-Speed PCBs
Consider return loss and insertion loss – but don’t stop there. READ MORE...
Characterizing Etchback and Dielectric Loss Tangent
Fabrication-aware simulations to aid PCB design success. READ MORE...
Sequential Lamination in PCB Manufacturing
Manufacturing high-layer count boards. READ MORE...
Implementing Flash Memory in PCB Design
Routing flash has EMI implications. READ MORE...
Flex Shock and Vibration
PSAs and carefully chosen connectors can reduce the shock of intense conditions. READ MORE...
Homepage Slideshow
Consider return loss and insertion loss – but don’t stop there.
https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18654-what-is-the-best-material-for-a-high-speed-pcb
Fabrication-aware simulations to aid PCB design success.
https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18652-characterizing-etchback-and-dielectric-loss-tangent
Manufacturing high-layer count boards.
https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18653-sequential-lamination-in-pcb-manufacturing
Routing flash has EMI implications.
https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18648-implementing-flash-memory-in-pcb-design
PSAs and carefully chosen connectors can reduce the shock of intense conditions.
https://www.pcdandf.com/pcdesign/index.php/current-issue/243-flexperts/18651-flex-shock-and-vibration
Printed Circuit Design & Fab Magazine
The three-day JPCA 2015 show was held starting June 3 at Tokyo Big Sight.
Zuken Innovation World 2015 Converges on Coronado Island in June
I have used an Apple personal computer since the early 1990s, and bought my second MacBook Pro almost five years ago.
When optimizing board area when considering thermal effects, the IPC charts aren’t enough.
Developing a wearable high-speed board with severe timing constraints.
BIOMEDevice 2015 was held at the Boston Convention & Exhibition Center on May 6.
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