Press Releases

ARLINGTON, WA ― June 2019 ― CheckSum, a leading provider of test systems, fixtures and programs, wants the world to know that their Parallel Technology offers many advantages by testing in line as opposed to in a test cell, avoiding costly potential issues down the line.

Read more: CheckSum Parallel Technology Reduces Inventory Pile-Ups

ALBUQUERQUE, NEW MEXICO -- 3D Glass Solutions, Inc. (3DGS), a leading innovator of glass-based, three-dimensional passive RF devices, announced today that it has secured an investment from aerospace and global security leader Lockheed Martin, as part of its Series B funding.

Read more: 3D Glass Solutions Secures Investment from Lockheed Martin Ventures

atg Luther & Maelzer GmbH (A COHU Company), is proud to announce the installation of its first extra-large format 24 test head flying probe system at the TTM Technologies Stafford Division.

Read more: atg's A7-24 Provides TTM Large Format Testing Capability

NESS ZIONA, Israel, May 30, 2019 (GLOBE NEWSWIRE) -- Nano Dimension Ltd., a leading additive electronics provider (NASDAQ, TASE: NNDM), today announced it has received a grant approval from the Israel Innovation Authority for developing hardware, in cooperation with Harris Corporation, that will fly on the International Space Station (ISS) and communicate with Harris’ ground based satellite tracking station in Florida. This project will provide a systematic analysis of 3D printed materials for radio frequency (RF) space systems, especially for Nano-satellites.

Read more: Nano Dimension, in Collaboration with Harris Corporation, Receives Grant Approval to Develop...

May 29, 2019, Tokyo, Japan—Toyochem Co., Ltd., a member of the Toyo Ink Group, announced today that it will be exhibiting in the 49th International Electronic Circuit Industry JPCA Show 2019 in Japan. At this year's show, the company will spotlight its latest advances in electronics-related materials based on the Group's unique materials and processing technologies, and propose solutions to meet the advanced performance needs of next-generation electronics designers.

Read more: Toyochem to Highlight EMI Shields, Adhesives for Electronic Circuits at JPCA 2019

CHANDLER, Ariz., May 28, 2019 (GLOBE NEWSWIRE) -- Rogers Corporation (ROG) today announced Technical Marketing Manager, John Coonrod, will present Critical Material Properties for 5G PCB Applications from 2:30 – 2:45 p.m. on Tue., June 4 and The Impact of Glass Weave Effects on mmwave PCBs from 2 – 2:15 p.m. on Thu., June 6 in the MicroApps Theater at the International Microwave Symposium (IMS) in Boston.

Read more: Rogers Corporation to Present & Exhibit Advanced Connectivity Solutions at IMS

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