ALBUQUERQUE, NEW MEXICO -- 3D Glass Solutions, Inc. (3DGS), a leading innovator of glass-based, three-dimensional passive RF devices, announced today that it has secured an investment from aerospace and global security leader Lockheed Martin, as part of its Series B funding.

3DGS provides unique, patented technology that spans the GHz spectrum and allows high-performance RF communication essential to both commercial consumer and complex avionics, space and security systems operating at high frequency. Delivering the ability to integrate functionality that has previously been unattainable due to conventional technology limitations, 3DGS’ glass-based solutions will enable systems designers to develop and produce state-of-the-art RF components.

“Lockheed Martin Ventures, the investment arm of Lockheed Martin, strategically invests in companies developing cutting-edge technologies within our existing businesses and new industries,” said Chris Moran, Lockheed Martin vice president for corporate development and general manager of Lockheed Martin Ventures. “We look forward to our relationship with 3DGS and gaining access to its advanced component design capability for high-frequency and heterogeneous electronics applications that could be applied to help address the size, weight and power demands across Lockheed Martin’s platforms.”

Commenting on the significance of the investment, 3DGS President and CEO, Mark Popovich, says, “The investment from Lockheed Martin Ventures underscores the importance of our solution for the aerospace sector. We are grateful that the Lockheed Martin Ventures team recognizes the impact 3DGS can have on next-generation, GHz spectrum systems operation and the technology’s ability to unleash unprecedented component design freedom.”

About 3D Glass Solutions

Based in Albuquerque, NM, 3D Glass Solutions (3DGS) is an innovative RF passive device design and manufacturing company that develops novel, high-frequency 3D components. Leveraging the unique properties of its APEX® glass-ceramic material, the company’s technology enables performance not possible with traditional 2D components. The result is passive components with superior electrical performance and ultra-low transmission loss at high frequencies ranging from 1 to 200 GHz. Using traditional semiconductor processes, 3DGS creates cost-effective, high-precision, high-volume scale components that meet the needs of both consumer commercial and mil/aero system designers. www.3DGlasssolutions.com

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