Press Releases

SAN DIEGO – Altium, a global leader in electronics design systems, announced today that its Altium 365 cloud platform and its Secure Collaboration application are now both available in AWS Marketplace, a digital catalog with thousands of software listings from independent software vendors that make it easy to find, test, buy, and deploy software that runs on Amazon Web Services (AWS).

Altium 365 brings a cloud-based suite of applications to enable the design and delivery of printed circuit boards (PCBs) and enables seamless collaboration across the electronics design and development process. Altium 365 applications allow design engineers, procurement professionals, system architects, IT administrators, and other stakeholders to work together in real-time, ensuring a faster, more efficient, more secure electronics design process. Secure Collaboration is the first application from the Altium 365 suite available in AWS Marketplace, enhancing the quality of electronics design collaboration by protecting valuable, proprietary designs with robust security. Secure Collaboration ensures that sensitive electronics design information remains protected as it moves through distributed teams, from concept to production.

AWS customers will now have access to Altium 365’s suite of applications directly within AWS Marketplace. They will be able to choose from a growing suite of Altium applications automating engineering design process management, ECAD connectivity, supply chain management, and data security, all within their AWS Marketplace account.

"We are thrilled to make our Altium 365 suite of applications available in AWS Marketplace," said Ananth Avva, VP and GM of Cloud Platform, Digital Industries, at Altium. "Workflows for electronics development must be centralized, secure, and adaptable to the rapid pace of innovation demanded by today’s electronics development teams. Now those innovators will be able to set their own pace with Altium 365 and use the Secure Collaboration application to work together confidently. This is the first of many apps we plan to launch in AWS Marketplace."

For more information on Altium and its Altium 365 cloud applications, please visit: altium365.com. To purchase the Secure Collaboration application on AWS visit: https://aws.amazon.com/marketplace/pp/prodview-xpaerlwievwyi?sr=0-1&ref_=beagle&applicationId=AWSMPContessa 

ZURICH – Scrona AG, a leading digital microfabrication startup known for deploying the world's first MEMS based electrohydrodynamic (EHD) multi-nozzle printheads, has announced a collaboration with Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging. The companies will partner on process development, optimizing the use of Electroninks' materials within Scrona's MEMS based EHD printhead technology, to drive new use cases in the semiconductor industry.

As part of their partnership, Electroninks will make its advanced materials available to Scrona for processing with Scrona's EHD printhead technology. Scrona will then explore ways to incorporate Electroninks' materials into its existing product lines and applications and potentially new generations of its printheads. Joint research and development will take place in Scrona's Zürich application lab and in a regional technology center in Taiwan.

"This alliance between Scrona and Electroninks will accelerate innovation in semiconductor manufacturing by pushing the boundaries of what's possible in packaging in target applications such as RDL repair and fine line metalization, via filling and 3D interconnects," said Patrick Heissler, CEO of Scrona. "Our R&D efforts and process development can help meet the growing demand for higher performance, device miniaturization and reliability. "

"By working together, our companies can drive the commercialization of advanced semiconductor packaging processes that utilize cutting-edge EHD print head technology," said Melbs LeMieux, cofounder and president of Electroninks. "This will allow our customers to better adopt fine line print/repair, and RDL metallization solutions, thereby enabling the integration of complex functionalities into compact semiconductor packages."

HUIZHOU, CHINA – Tom Yang CEO of CEE PCB has announced the appointment of industry veteran Jerome Larez to the position of Field Application Engineer (FAE) North America.

Mr. Larez has held a number of technical sales positions with printed circuit board companies. Most recently with MicroConnex corporation. He started his career in the industry with Prototron Circuits both in their Tucson and later Redmond division. His career has crossed both engineering and sales making him an ideal candidate for his new FAE position.

Mr. Yang said, “Jerome bring s a depth of technical and sales knowledge as well as a great deal of experience in the North American PCB market. His experience and energy and as well as his passion for helping customers is exactly what we are looking for as we enter the North American PCB market.”

Added Mr. Larez. I am looking forward to this new chapter in my life. The Capabilities and Technologies that CEE-PCB brings to the market is something that I was really looking for in my next company. I am very optimistic about working with CEE-PCB.”

HONG KONG – STARTEAM GLOBAL, an established printed circuit board (PCB) manufacturer with over 35 years of expertise, is pleased to announce new strategic partnerships with two German corporations: Notion Systems GmbH, a manufacturer of inkjet printing systems for functional materials, and Lackwerke Peters GmbH & Co. KG, also known as Peters Group, a full-range supplier of coating materials for electronics and PCBs worldwide.

Transition to Additive Solder Mask Process at New FST Factory

The technologies from Notion Systems and Peters Group will be integrated into STARTEAM’s new factory in Flero, Italy, named Flero STARTEAM (FST), transitioning from the traditional solder mask process to the emerging technology of the additive solder mask process. By integrating their innovations, the additive solder mask process is set to be revolutionised through their combined synergy.

Adoption of Notion Systems' Innovative n.jet Technology

FST will feature Notion Systems' n.jet solder resist system, which is scheduled for installation. By utilising Notion Systems’ cutting-edge inkjet technology, the FST factory will be able to digitally apply solder resist and legend. The inkjet technology offers rapid, efficient, and clean processing that aligns fully with sustainability strategies due to its digital and additive imaging capabilities. It significantly reduces the associated steps compared to the traditional solder mask process, allows for different resist thicknesses in different regions, offers high-level alignment, and supports custom automation — all under controlled and stable conditions.

Leveraging Peters’ Advanced Elpejet® Inkjet Solder Mask

With Peters’ inkjet solder mask Elpejet® IJ 2467 for additive manufacturing, this advanced technology enhances the production of superior print images. It boasts compatibility with all common print heads across various inkjet printers, ensuring precise edge coverage and coating thickness according to specifications. Additionally, it offers outstanding moisture and insulation resistance and remains crack-free even after multiple reflow soldering cycles.

Commitment to Enhance Quality and Efficiency in PCB Production

Utilising technologies from both Notion Systems and Peters, STARTEAM GLOBAL is optimising the additive solder mask process through collaborative innovation. STARTEAM’s Chief Technology Officer, Martin Schneider, highlights the importance of this selection: “We chose Notion Systems and Peters Group because they offer a mature and easy-to-use technology, along with a very good support structure featuring close and cooperative collaboration right up to senior management. In general, we believe our cooperation will accelerate the integration of the additive solder mask process into the electronic market and PCB manufacturing industry, making PCB production more economical and ecological.”

This strategic move underscores STARTEAM's commitment to advancing PCB production technology, serving as a driver to elevate product quality and boost manufacturing efficiency.

PETACH TIKVA, ISRAEL – Eltek Ltd. (NASDAQ: ELTK), a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards, announced today that it received orders totaling $3.5 million from two defense customers. The products are with high technology requirements and to be delivered beginning in the fourth quarter of 2024 through the end of 2026. The Company expects to receive additional long-term orders from these customers in the near term.

"The orders are in accordance with our policy of striving for long-term orders which allow optimal production planning and maximum efficiency and profitability," commented Eli Yaffe, CEO of Eltek.

NORTHFIELD, MN – The Flexible Circuit Assembly Center of Excellence at All Flex Solutions is pleased to announce a key hire and a promotion in their operation in Bloomington, Minnesota.

All Flex Solutions is excited to announce the hire of Jamil Abdallah as the Manufacturing Plant Manager for flexible circuit assembly. Jamil comes to Allflex with 15 years of manufacturing management experience in various industries including Automotive, Fabrication, including five years in flexible circuits and thermal foil heater manufacturing. Jamil was born in Tunisa, and can speak, read, and write in 3 languages. He holds a Bachelor of Science in Applied Economics and Management. Jamil has 4 children, is an avid soccer player and a triathlete! He has a personal goal to run the Twin Cities Marathon this year and participate in the iron man event next year. Jamil also enjoys riding his motorcycle, cooking, and studying world history.

All Flex Solutions is pleased to announce the promotion of John Geerdes to Senior Process Engineer of the flexible assembly and finishing areas. John has a Chemical Engineering degree and has broad experience in the processes used to fabricate flexible circuits, which will make him ideal in his new role. John also has a Quality Engineering background, making him very well rounded in all aspects of our manufacturing operations and Quality Management Systems.

Jamil and John join a gifted assembly team that is committed to customer satisfaction, technology advancement and yield improvement.

“We provide assembly services to our flexible circuit, rigid flex and flexible heater customers” offered Bob Burns. “It is convenient for our customers, but also sometimes assembling flexible circuits can be challenging due to dimensional movement in flexible circuits. Our team has the experience to succeed in building our customer’s bare boards and assembly.”

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