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  • Optimizing Mixed Signal Circuit Designs

    Optimizing Mixed Signal Circuit Designs

    Navigating the analog and digital worlds.  READ MORE...

  • Developing Organizational Culture for Troubleshooting

    Developing Organizational Culture for Troubleshooting

    Solving problems and adding value.  READ MORE...

  • Cloud Collaboration

    Cloud Collaboration

    Real-time breakdowns cost more than you think.  READ MORE...

  • The Experts' Take on AI

    The Experts' Take on AI

    What’s working now and what’s not (but should be).
      READ MORE...

  • Designing for High-Pin Count Devices

    Designing for High-Pin Count Devices

    Overcoming “anywhere but here.”  READ MORE...

  • Bluetooth Design

    Bluetooth Design

    6 steps for limiting interference and data loss.  READ MORE...

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Press Releases

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Category: Press Releases

New Plano building will host office space, labs and manufacturing facilities for both sensors and passive components

Read more: TT Electronics Announces Move to State of the Art Facility Near Dallas

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A faster way to design and manufacture AI-enabled boards

Read more: Designing Embedded AI PCBs made Easy with Coral from Google and Upverter

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WASHINGTON—April 12, 2021—The Semiconductor Industry Association (SIA) today released the following statement from President and CEO John Neuffer regarding today’s meeting at the White House between Biden Administration officials and leaders from the semiconductor industry and other sectors to discuss the global chip shortage, President Biden’s infrastructure plan, and other issues related to the semiconductor supply chain. Meeting participants included SIA board members Tom Caulfield, CEO of GlobalFoundries, Pat Gelsinger, CEO of Intel, and Sanjay Mehrotra, CEO of Micron Technology, along with senior executives from SIA member companies NXP, Samsung, and TSMC.

Read more: White House Chip Summit Builds Momentum for Federal Investments in U.S. Chip Manufacturing and...

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NI to contribute its expertise to assessing advanced wireless research needs that will shape the future business, social and technical landscape for 6G

Read more: NI Joins the Next G Alliance to Help Build North America’s Leadership in 6G

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Santa Clara, CA  April 12, 2021 – Averatek Corporation has announced FTG as an A-SAP licensee.  A-SAP is an advanced PCB manufacturing technology that enables feature sizes of 25 microns and below, effectively providing PCB designers with new opportunities to address the challenges of next-generation electronics.

Read more: Averatek Announces A-SAP License Agreement with Firan Technology Group (FTG)

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Tewkesbury, UK: Trackwise is delighted to announce the appointment of Steve Hudson as Chief Operating Officer. He will support CEO Philip Johnston in executing the company’s strategy and vision as Trackwise expands to serve customers in its key verticals: automotive, aerospace and medical.

Read more: Steve Hudson appointed as Chief Operating Officer to support Trackwise’s expansion

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