PCB Supplier NCAB Group today announces the departure of Elmatica CEO Didrik Bech.
Former USAF Chief Software Officer to Discuss Agile and DevSecops
Update to Groundbreaking 2001 Research Will Capture and Analyze Industry Transformation in Past 20 Years
IDTechEx - Cambridge, UK - IDTechEx Discuss the 5G Materials Battle: Sub-6 GHz vs mmWave
Austin, Texas February 10, 2022. High Density Packaging (HDP) User Group is pleased to announce that industry expert Dr. Bev Christian, HDP Facilitator, has been awarded the Dieter Bergman IPC Fellowship Award.
Rafal Przeslawski, Xilinx takes top prize
BANNOCKBURN, Ill., USA, February 10, 2022 — The inaugural IPC Design Competition at IPC APEX EXPO 2022 resulted in a win for Rafal Przeslawski, Xilinx, whose printed circuit board design earned him the top prize.