Press Releases

PCB Supplier NCAB Group today announces the departure of Elmatica CEO Didrik Bech.

Read more: NCAB Group Announces Departure of Elmatica CEO

Former USAF Chief Software Officer to Discuss Agile and DevSecops

Read more: Zuken and Vitech Announce Nicolas Chaillan as ZIW/Integrate22 Keynote Speaker

Update to Groundbreaking 2001 Research Will Capture and Analyze Industry Transformation in Past 20 Years

Read more: ECIA and Texas A&M University Launch Major Research Project Quantifying Value of Authorized...

IDTechEx - Cambridge, UK - IDTechEx Discuss the 5G Materials Battle: Sub-6 GHz vs mmWave

Read more: IDTechEx Discuss the 5G Materials Battle: Sub-6 GHz vs mmWave

Austin, Texas February 10, 2022. High Density Packaging (HDP) User Group is pleased to announce that industry expert Dr. Bev Christian, HDP Facilitator, has been awarded the Dieter Bergman IPC Fellowship Award.

Read more: Dr. Bev Christian wins the Dieter Bergman IPC Fellowship Award

Rafal Przeslawski, Xilinx takes top prize

BANNOCKBURN, Ill., USA, February 10, 2022 — The inaugural IPC Design Competition at IPC APEX EXPO 2022 resulted in a win for Rafal Przeslawski, Xilinx, whose printed circuit board design earned him the top prize.

Read more: IPC Design Competition Winner Announced at IPC APEX EXPO 2022

Page 92 of 314

Subcategories