SANTA CLARA, CA – LQDX, developer of high-performance materials and process IP for advanced semiconductor manufacturing, today announced that it has signed a multi-year sales and licensing agreement with Kansai Denshi Industries (KDI), enabling manufacturing support for next generation IC-substrates in semiconductor packaging and advanced printed circuit boards.

Under the terms of the transaction, LQDX will supply its Liquid Metal Ink (LMIx®) chemistries and Aluminum Clad Laminate (ACL®) products via its partnership with Toyal-Alconix, as well as a process license for Ultra High-Density Interconnect technology to support the rapidly growing demand in the Japan-Asia market. LQDX's technology enables Kansai Denshi, who has been producing 30-micron trace/space circuits, to leapfrog, via development, to 5-micron trace/space products today with a path to 2-micron trace/space by 2025.

"We are delighted to complete this deal with Kansai Denshi, and to support it through our partnerships with Toyal and Alconix," said Simon McElrea, LQDX CEO. "Japan is a critical global hub for the Heterogeneous Integration market infection, and we have been building our supply chain eco-system partnerships in-region with key material, equipment and manufacturing leaders. We look forward to supporting the Asian market with advanced interconnect prototyping and manufacturing in the second half of this year."

Zazunori Miyabe, Board Director of KDI inc. stated, "For a long time, Kansai Denshi Industries has specialized in developing and acquiring the latest technologies to provide our customers with the most advanced circuit designs and manufacturing solutions. By adding LQDX's Liquid Metal Ink (LMIx®) technology to our portfolio, we are now able to provide the most advanced IC-substrates and printed circuit boards for the highest performing applications."

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