Upgrade your skills for free with Elsyca’s webinars on their new simulation tools for PCB and panels!
Elsyca developed a new exciting technology for PCB CAM engineers and Designers to validate the panel layout against plating targets and automatically add copper balancing. This results in panels with a more uniform layer thickness distribution and less plating related production problems.
These skills will give you a competitive advantage as it will enable you to meet your customer needs more effectively than competitors.
Elsyca also offers separate webinars for Process Engineers to upfront identify problems and solve these problems before you implement a configuration and before start of production.
The details on the webinars for PCB CAM engineers and Designers can be found here.
Process Engineers can use this link.
Elsyca offers free white paper on how Plating Simulation Raises Yield and Profitability!
Problems with non-uniformity in PCB copper pattern plating are typically described as "the FAB problem".
But imagine how much time and money one could save when each player in the process (Design -> CAM -> Production) would be able to identify potential problems at an early stage.
What if the PCB pre-production engineer could upfront identify problem areas for the pattern plating and apply auto-intelligent copper balancing, as part of the CAM process to provide a right-first-time panel layout for production?
And what if the process engineer has a software that accurately predicts the impact of plating parameters on the layer thickness distribution to increase first pass yields on new PCB parts?
Download Elsyca’s new white paper to learn more about production-proofing PCB copper plating.