Berlin, November 22, 2019: Atotech, a leading surface-finishing solutions provider, delivering chemistry, equipment, and service to support diverse end-markets such as mobile devices, computers, consumer electronics, the global automotive industries, and many others, will present at the 2019 International Electronics Circuit Exhibition in Shenzhen, China, on December 4th – 6th.

On Thursday, December 5, Atotech expert Kuldip Johal will give a presentation entitled: “Moving to mmWave – how does this impact the PCB / IC substrate”, from 2:00 – 2:40 p.m. at the International Technical Conference area in hall 4.

Visitors of the HKPCA 2019 are welcome to join Atotech’s expert talk on 5G trends, challenges and solutions and to stop by the company’s booth 2D21. Mr. Johal and several other global and local Atotech experts will be available to discuss the latest product innovations and trends.

Atotech’s key highlights at the booth include:

vPlate – Vertical continuous copper plating technology of choice for advanced HDI and IC substrate.
Polygon PLB Line – Atotech’s new desmear and electroless copper system.
ViaKing – Atotech's new enhanced graphite direct metallization for flex and advanced base materials.
Noviganth AF – High build self-accelerating electroless copper process.
InPro THF2 – Atotech’s (a)mSAP BMV filling process for best uniformity with high ductility.
InPro MVF2 – Advanced BMV filling in VCP equipment for HDI production.
BondFilm HF1000 – Bonding enhancement process for high frequency manufacturing.
CupraEtch SR8000 – Dryfilm and soldermask pretreatment with advanced adhesion performance.
PallaBond – Direct pure EPAG for ultra fine L/S application.
Stanna-COF – Immersion tin for chip on film.
Spherolyte Cu UF3 – Cu RDL process for fine line plating and microvia filling.

For more information about Atotech or its product offering, please visit www.atotech.com or contact us at: This email address is being protected from spambots. You need JavaScript enabled to view it..

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