BERLIN, May 31, 2018: Atotech today announced that it will present its latest production solutions for the flex/ flex-rigid PCB market at the New Product Introduction (NPI) sessions at the JPCA 2018 show. The trade show will be held from June 6 to 8, 2018, at Tokyo Big Sight, East Exhibition Halls 4 to 8, in Tokyo, Japan. Next to its presentation, the company will also showcase new products from various other fields at booth 7A-16.  

On Friday, June 8, from 2:50 to 3:20 pm, Jun Hotta, Manager Electronics Business Division at Atotech Japan K.K., will introduce Atotech’s new product series for flex/ flex-rigid PCB at 7H-NPI Presentation Site 2. Product highlights this year are Atotech’s new Securiganth® 800, a very reliable smear removal for through holes and surfaces, InPro® THF and InPro® MVF, two new acid copper baths ideal for superior copper filling at highest current densities, and Stanna-COF, an immersion tin bath for Chip On Film (COF). Jun will also talk about CovaBond®P 100, an adhesion enhancement process which enables unparalleled adhesion of electroless copper to the treated substrate with minimum surface roughness.

Register now for PCB WEST, the largest trade show for the printed circuit and electronics industry in the Silicon Valley! Coming Sept. 11-13 to the Santa Clara Convention Center.

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