Products

Affinity ENIG 2.0 is a high-reliability, low-variation electroless nickel immersion gold plating process.

Read more: MacDermid Enthone Debuts Affinity ENIG 2.0

FLIR ETS320 is designed for real-time benchtop viewing, testing and analyzing of thermal characteristics of electronic components and printed circuit boards.

Read more: FLIR Systems Launches ETS320 Thermal Imaging System

Polyonics adhesive transfer tapes include double liners for ease of handling and die cutting, provide high bond strengths, are chemical-resistant and reportedly ideal for use in high-temperature and harsh environment applications.

Read more: Polyonics Introduces Adhesive Transfer Tapes

Talon 3 electroless palladium allows plating directly onto copper. Paves the way for electroless palladium/ immersion gold (EPIG).

Read more: Uyemura Rolls Out Talon 3 E-Pd

Deutsch 369 series connectors include two new versions enabling integration directly to printed circuit boards.

Read more: TE Connectivity Expands Deutsch 369 Series Connectors

PCB Clustering for OrCAD provides AutoClustering technology, intelligent design (IP) reuse and replication technology that can reduce board placement time.

Read more: EMA Releases PCB Clustering for OrCAD

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