BluePrint-PCB v. 3 for PCB documentation now features enhancements to the panel drawing feature and dimensioning and assembly reference designator functions. Upgrades include flip panel support; flipped images supported in panel setup; flipped image updates support mapped layer display; auto calculation settings for panel matrix maintained in spreadsheet mode for panel setup; panel corner chamfering now defined in the panel setup; web route display merging now removes score line display for score lines that intersect web routes; web route display removes web route display for web routes that cross inside board outlines, and snapping to mill tabs is updated for mill tab placement, dimensioning to mill tabs and mill tab alignment. Performance updates made for designs with complex board outlines; scaling support added for panel drawing setup; can specify for panel, PCB or both; exploded view pictorial display can be placed onto a separate sheet from the source PCB view; outline for an exploded view can be defined as a closed polyline, and when component outlines overlap, the associated reference designators are placed inside owning component outlines without reference designator overlap. New controls are available to specify display order for data types within a PCB View; callout bases and coordinate dimensioning text can now be aligned. Reference designators can be found that overlap component outlines or other reference designators. Tooling holes can be found that have been added, deleted, or modified on re-import of CAD data. Edges of the board outline can be found that have modified on re-import of CAD data. Dimensions not tied to a PCB view or shape can be found. Customization to BluePrint-PCB menus and toolbars can now be saved to an external file and restored to new BluePrint-PCB installations. Mentor Boardstation ODB++ import interface extended to support polarity markings defined in the CAD database. Two BluePrint release packages can be merged into one release package. More than 50 customer defects and enhancements resolved.

DownStream Technologies, www.downstreamtech.com

Syron 7000 and 7100 thermoplastic laminates are said to have higher melt temperature than PTFE. Have estimated UL relative thermal index of greater than 210°C. Are flame-retardant, halogen-free and compatible with Pb-free solder processes. Resistant to solvents and reagents commonly used in printed circuit board processing; can operate in harsh chemical environments. Are suitable for flex-to-install applications, lightweight feed manifolds, automotive sensors, and in electronics for oil and gas exploration. Are available with 0.5 oz. low-profile electrodeposited copper foil cladding and in panel sizes that include 12" x 18" and 24" x 18". Feature dielectric thickness of 0.002" with thickness tolerance of ± 12.5%. Have max. z-axis Dk of 3.4 at 10 GHz, with max. z-axis dissipation factor of 0.0045 at 10 GHz. Offered with dielectric thicknesses of 0.002" and 0.004"; tolerance of ± 12.5%.

Rogers Corp., www.rogerscorp.com