New Products

RT/duroid 6035HTC high-thermal-conductivity laminate is for low loss in high-power circuits. Fluoropolymer composite material is for RF and microwave applications. Features relative Dk of 3.5 at 10 GHz, thermal conductivity of 1.44 W/mK and loss tangent of 0.0013 at 10 GHz. Is said to have superior heat-transfer characteristics. Fabricated with thermally stable, reverse-treated and electrodeposited copper foils. Supports clean drill holes with minimal tool wear. Available in a variety of dielectric thicknesses and cladding options.

Rogers Corp., www.rogerscorp.com

Eagle v. 5.11 CAD incorporates new functionality for automatic search and online pricing and availability. Setup and save options now available for individual order lists for schematics, and lists can be added to a shopping cart. Manufacturer libraries are now supplied with order codes. Has three main elements: schematic, layout and autorouter.

CadSoft Computer, www.premierfarnell.com

 

ECP SiP embedded component packaging technology enables system-in-package devices. Is for integrating active and passive components into PCBs. Used in products that need to fit the largest possible number of features into the smallest possible space.

AT&S, www.ats.net

Four-ply, peel-n-stick FPDSEM 90 cooling patch reduces chip and circuit temperature by as much as 11% without the need for a heatsink. Thermal material radiates heat from an electronic component to the surrounding environment. Apply patch like a sticker to the surface of any hot spot. Can be custom cut or trimmed to fit virtually any shape. Provides a thermal conductivity of 1.5 W/m°K and a thermal emissivity of 0.97. Is 25 mm thick and can be ordered in sheets, rolls or kiss-cut rolls.

Fujipoly America Corp., www.fujipoly.com

Advanced Sweller process chemistry has a wide operational window. Handles normal and high performance laminates, using sustainable solvent and low operating concentrations.

Dow Electronic Materials, www.dow.com

Advanced SAP Metallization semi-additive process chemistry includes neutralizer, conditioner and electroless copper. Provides high dielectric adhesion with low roughness, plating coverage on both via bottom and surface, excellent bath stability and reliability performance for ultra fine lines.

Dow Electronic Materials, www.dow.com

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