New Products

PCB Panelizer automates panelization for raw material utilization and manufacturability. Automates nesting of boards, arrays and coupons for panel utilization and manufacturability for both rectangular and complex shapes. Accommodates complex shapes, including flex and rigid-flex boards; enables nesting of multiple boards, arrays and coupons in the same panel; imports and exports engineering data such as Gerber, CAM, DXF files with other preproduction applications; includes a layout editor for fine-tuning panel layout; produces dimensioned PDF drawings; integrates with other preproduction and ERP solutions, and optimizes the number of guillotine cuts.

Cimnet Systems, www.cim-sys.com 
Consona Corp., www.consona.com

804 and 805 series interconnects are for high pin count I/O and board-to-board applications. Triple row pin field permits signal connections to be densely packaged. Triple row package is on 0.100" grid; is available from 9 to 96 position configurations (ordered in increments of 3). Are RoHS-compliant, featuring high-temperature thermoplastic insulators compatible with Pb-free soldering temperature requirements. Receptacle shells are plated with pure matte tin. Have hard gold plating. Feature high-speed screw-machined pins and receptacles manufactured to precision tolerances. Inside each 805 series receptacle is a stamped beryllium copper contact clip with a pin acceptance range of 0.025 - 0.037" diameter or a .025" sq. post and a current rating of 4.5A.

Mill-Max Mfg. Corp., www.mill-max.com

PE-50 XL benchtop plasma cleaner includes an implosion-proof rectangular welded aluminum vacuum chamber. Has a chamber working area of 8" x 8" x 4". Standard features included single 5" x 5" horizontal electrode; 125W @ 50 kHz RF generator; precision needle valve flow control 0-25 CC/min; Pirani vacuum gauge 0-1 torr; 5 CFM oxygen service vacuum pump, and a single process sequence. Applications include medical devices, solar cells, printed circuit boards, connectors, MEMs, nanotechnology and wafer-level packaging.

Plasma Etch, www.plasmaetch.com

Sherlock automated design analysis software analyzes, grades and certifies expected reliability of printed circuit board assemblies. Can design-in product reliability earlier in the product development process; provides results within hours. Incorporates physics-of-failure.

DfR Solutions, www.dfrsolutions.com

Reference Design Library Beta is available online. Is an interactive resource for design engineers. Permits filtering based on the designs’ measured performance. Can find a variety of AC/DC and DC/DC conversion, audio amplifiers, and lighting driver designs, along with motion and power management resources. New models and solutions are added weekly.

Digi-Key Corp., www.digikey.com

Plasma Finish is an ultrathin fluoropolymer coating applied using a plasma deposition chamber. Reportedly creates a continuous, defect-free film that is just nanometers thick everywhere that the active gas plasma comes into contact with the surface, including high aspect ratio vias. Has stable chemical properties said to greatly extend PCB shelf life, actively repelling water and preventing contact with corrosive gasses. Ensures wettability. Combined with a precleaning step, eliminates activating, plating and rinsing stages in a traditional line. Is completely removed during solder joint formation, resulting in a reliable CuSn intermetallic layer.

Semblant, www.semblantglobal.com

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