New Products

Si9000e transmission line field solver now adds surface-modeling of both sides of copper printed circuit board layers into insertion-loss calculations. Models matte and drum surfaces of copper layers. Is compatible with Polar Speedstack layer stackup design tool. Can import material Er and Tan delta over multiple frequencies. Boundary-element method field solver models more than 100 PCB transmission line structures. Predicts impedance, attenuation, RLGC, and S-parameters with frequencies ranging from a few kHz up to the point where the line ceases to operate in TEM mode, typically around 100GHz. Can explore “what if” scenarios for rapid simulation of the impact of different materials and geometries. Can document complex stackups in minutes. Can be used in pre-layout design, reference chipset stackup design and post-layout modeling of impedance and insertion loss.

Polar Instruments, www.polarinstruments.com

DF59 2mm pitch connector provides wire-to-board, board-to-board joint and short-circuit sockets in a single connector design. Is ideal for LEDs and applications that require a small connector. Has a swing lock that uses positive and friction locks, giving wire-to-board type connections cable pull force resistance. Cable end is mated at a slight angle; other end of the plug is pushed down to complete mating with an audible click. Provides stress-free contact for 0.5mm floating function in XYZ directions. Has a height of 2.5mm and overall size of 8 x 9mm. Has a 2mm pitch and is available in 2, 3 and 4 positions. Has a high current capacity of 3A (with AWG 22 cable) and a high contact lance strength for wire-to-board type connections. Is RoHS-compliant.

Hirose Electric Co., www.hiroseusa.com

DH series small interface connector is for high-speed data transmission. Has 1mm contact mating pitch and a 0.5mm mounting pitch. Can handle up to 2.5 Gb/s speeds. Ideal for enterprise networking, industrial, telecom and datacom applications. Is a shielded, impedance-controlled connector that has a 50% reduction in the mating face area due to smaller pitch sizes. Plug has a D-shaped interface design; resists wrenching forces, while the receptacle's through-hole style metal fittings increase retention to the printed circuit board. Is available in a screw lock version with either screwdriver- or hand-tightened screws, and a one-touch lock version with metal or plastic buttons. Design offers unique contact arrangement for IDC termination and excellent shielding for EMI prevention. Measures 43mm x 39mm x 14.3mm; is available in 17, 27, 37 and 51 contact positions. 

Hirose Electric Co., www.hirose.com

RoHS-compliant Type BR solderless LED socket is for quick termination of Bridgelux RS LEDs. Reportedly eliminates the need for complex metal clad printed circuit board assembly into a lighting fixture; provides ease of assembly in a fixture using hand tools; has poke-in wire termination method for 18 through 22 AWG solid wires, 18 through 20 AWG pre-bonded wires and 18 AWG stranded wires. Standoff posts position the solderless LED socket assembly onto the heat sink; four M3 or #4 screws are required. LED is retained in the socket housing with a slight press fit prior to mounting the assembly into the light fixture. Space is available for custom optical solutions; wire strain reliefs to prevent wire pullout after assembly; UV-resistant housing material for outdoor use to prevent housing discoloration. Socket is UL-recognized to UL 1977 for use in UL 8750 applications.

TE Connectivity, www.te.com

Zebra Gold 8000C is an interconnect device constructed from a low durometer silicone core. Is covered with 166 parallel rows of flat, gold-plated wires per inch. Connector can accommodate printed circuit boards with pad center spacing down to 0.020".

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CR-5000 revision 13.0 design suite for electronics systems and printed circuit boards introduces new core technology for power integrity analysis along with an array of developments to accelerate process optimization and integration including more efficient DRC checking, improvements in hierarchical design, management of constraint data and more.

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