Log in / Register
  • Thermal Vias are Ineffective. Here’s Why.

    Thermal Vias are Ineffective. Here’s Why.

    Adding thermal vias can take up valuable board space with little benefit.
      READ MORE...

  • Connecting the Industry, from Boards to Assemblies

    Connecting the Industry, from Boards to Assemblies

    HDP is embarking on new rounds of evaluations of laminates and lead-free solders.
      READ MORE...

  • Exploring the Impact of AI

    Exploring the Impact of AI

    A special panel discusses the growth of AI tools and its possible effects on the industry.
      READ MORE...

  • A Journey in Rigid-Flex Design

    A Journey in Rigid-Flex Design

    Overcoming the challenges of rigid-flex designs can be incredibly rewarding.
      READ MORE...

  • Creating the Ultra Library

    Creating the Ultra Library

    Building and maintaining what's said to be the world's largest CAD database requires strong relationships.
      READ MORE...

Homepage Slideshow
  • Home
  • Editorial
  • New Products

New Products

Details

MULINO, OR -- Printed circuit board prototype manufacturer Sunstone Circuits has added SMT stencils to its product line.

Read more ...

Details

STMicroelectronics and Microchip Technology component libraries come with complete schematic symbols and printed circuit board footprints.

Read more ...

Details

E³.series electrical CAD software suite for engineering, design, documentation and manufacturing wiring harnesses, cable assemblies and other electrical gear performs first phase electrical planning in the same software environment as schematic, harness, fluid and panel design.

Read more ...

Details

ICD Stackup Planner - HDI Designer Edition impedance calculator/stackup planner includes multiple differential pair definitions per layer.

Read more ...

Details

Studio Suite v. 2011 SP5 offers transient bidirectional co-simulation between cable currents and electromagnetic fields in the surrounding space.

Read more ...

Details

The QFN package design kit for Agilent’s Advanced Design System electronic design automation software is based on MicroLeadFrame packages. Enables mutual Amkor and Agilent customers to improve RFIC/MMIC design quality and time-to-market. Can explore various design specifications with package information and implement optimized RFIC/MMIC designs. Contains models for 3 x 3, 4 x 4, 5 x 5, and 6 x 6 MLF QFNs. All die are scalable; material properties can be modified. Includes scalable models for bond pad arrays and board via arrays.

Amkor, www.amkor.com

Page 266 of 388