Printed Circuit Design & Fab Online Magazine - New Products

New Products

Sarcon 50G-Hm is a high-performance, low-resistance gap filler pad manufactured with a low-tac top surface. The one-sided treatment is reportedly less sticky than the opposing surface; thermal pad adheres to target electrical component or opposing heat sink. Provides removal without ripping, warping or damaging the interface material. Transfers heat with a thermal conductivity of 6.0 W/m°K and a low thermal resistance of .16°Cin2/W at 72.5 PSI. This 0.5mm-thick, flame-retardant TIM is available in sheets up to 300mm x 200mm.

Fujipoly America Corp., www.fujipoly.com

PE-100 Convertible incorporates two individual plasma etching/cleaning type/mode technologies into one standalone plasma etching/cleaning system. Can switch back and forth between RIE anisotropic type etching mode applications and isotropic type etching/cleaning mode applications. Is used for R&D, medical devices, solar cells, nanotechnology, optics, printed circuit boards, MEMs, wafer level packaging, laboratory applications, and other related semiconductor processes.

Plasma Etch, www.plasmaetch.com

Temperature and Chemical Resistant Tapes using novel ThermoGard technology to remain dimensionally stable in extreme manufacturing environments up to 500°C.

SymTA/S 3.0 and TraceAnalyzer 3.0 are system-level tools for model-based design and trace-based verification. Are targeted for automotive, aerospace, automation and other performance- and safety-critical systems. Reliable for dimensioning, optimization, regression-testing, and verification of controllers and networks, focusing on load, task and message latencies, system schedulability, end-to-end timing, data consistency and other properties that ensure system correctness. Deliver support for model- and trace-based timing analysis. Can merge controller or network traces into existing SymTA/S models. Can start from traces and change the system configuration virtually to predict performance impact of additional tasks or messages, different scheduling strategies or faster hardware. Can iterate designs multiple times. SymTA/S 3.0 enhances distribution analysis and provides direct CAN-ID support with both hexadecimal and decimal visualization, in addition to assigning priority values for CAN bus configuration. Report generator provides a difference report between two system revisions. AUTOSAR XML import function supports shared variables. Communication overhead analysis capability provides support for multi-core controllers. TraceAnalyzer 3.0 provides support for Vector Informatik’s FlexRay trace/log file format and CAN multi-channel support for its CANoe ASC trace/log file import interface. A report generator has also been added.

Symtavision, www.symtavision.com

Coolit v. 11 and CoolitPCB v. 7 computational fluid dynamics tools include volume visualization using color fog. When combined with sectional view planes, fog helps analyze complex spatial distributions. A second tool is automatic flow visualization and animation. Based on streamrods and streamribbons, the one-click option automatically distributes injectors throughout the solution field and injects particles that show flow direction, velocity, swirl, and local value of a scalar variable, such as temperature, at the particle’s location. Coolit v.11 has improved CAD models import capability. CoolitPCB v.7 adds new components to its library, such as triangular prisms and inclined baffles.

Daat Research Corp., www.daat.com