Cranston, RI –Technic Inc. has released a patented electrochemical analyzer, the Technic EBA (Electrochemical Bath Analyzer). Currently available for all Technic acid copper plating chemistries, the instrument reportedly utilizes a combination of AC and DC voltammetry to provide accurate measurement of copper metal, sulfuric acid and organic additive levels.
The combination of AC and DC electrographic methods along with a state-of-the art chemometric approach is said to make it possible to precisely measure low-level organic additives not possible with DC methods alone. According to the company, when compared to other analytical techniques the Technic EBA reduces sample preparation and analysis time while improving accuracy.
MUNICH, Germany and WESTFORD, MA– CIM-Team and parent company Zuken have announced the availability of E³.series 2007. The advancements in the latest version of the Windows-based electrical control design and documentation suite reportedly include functionality improvements relating to 3rd party integration and increased ease of use and productivity. This latest version of E³.series includes enhancements to the certified SAP interface, along with support of 3D-MCAD data in STEP AP203/214 Format and MicroStation data. The improved SAP interface is said to allow organizations to quickly and easily modify master records without having to enter the SAP environment. In addition, users can also edit component and classification material master data directly within E³.series using the online synchronization interface.
To support the custom wire and cable harness market, E³.formboard is being launched. This additional integrated module of the E³.series has been designed for the creation of nailboard displays required in producing wire and cable harnesses. E3.formboard makes it possible to create connector tables automatically, graphically display manufacturing and displayed lengths, apply automatic stretching and compressing to cables, as well as rotate cable branches.
CHICAGO – A.W.T. World Trade Inc. has introduced its Accu-Cure UV Curing Unit in a compact unit designed to fit in smaller-than-average footprints, making it especially well suited for lab environments and testing areas, as well as the smaller screen print shop.
The Accu-Cure’s conveyor width is 12 inches, but reportedly provides an excellent high-gloss protective coating which increases a product’s resistance to abrasion.
Engineered for high-speed curing of vinyl, polyester, paper and other substrates, the Accu-Cure UV Curing Unit’s computer-designed cooling system minimizes heat transmission to the stock in the curing chamber.
The Accu-Cure comes as one of five packages; 1) a complete conveyorized UV curing system with one or two curing heads, vacuum holddown and exhaust system, 2) curing heads with light guard assembly, 3) vacuum holddown retro-fit package, 4) additional conveyer sections by the foot, and 5) conveyor unit with vacuum holddown.
CRANSTON, RI – Technic Inc. has released CU 2800, an advanced acid copper electroplating process designed specifically for improving leveling of high aspect ratio PCBs at reduced plating times.
Using an innovative, proprietary brightener compound, CU 2800 is said to provide significantly improved throwing power reportedly making it possible for faster plating times.
Technic CU 2800 provides deposit leveling without the use of traditional stress inducing leveling agents. The end result is said to be a fine grain deposit exceeding the performance requirements of the most advanced PCB structures.
All Technic CU 2800 components are fully analyzable using Technic’s Electrochemical Bath Analyzer as well as other established quantitative methods.
MUNICH, Germany and WESTFORD, MA – Zuken has announced the availability of free footprint data for Altera Corp.’s recently announced low-cost Cyclone III FPGA family. Zuken’s CR-5000 enterprise wide design solution users can download the Cyclone III footprint design templates, eliminating the task of manually entering footprint data into their CR-5000 libraries. “At Zuken we see it as an important objective to do everything we can to facilitate the adoption of new technology for our customers,” said Werner Rissiek, Zuken general manager of Engineering, Europe. “Through our partnership with Altera, we are continuing to provide the integration needed within the electronics industry for our customers to remain competitive in the marketplace.”
The Cyclone III family is Altera's third-generation of low-cost FPGAs offering lower power with greater logic, memory and multiplier densities than previous generations. The availability of the footprint data as a free download from Zuken is another means to enable the efficient adoption of this new technology.
SYDNEY, Australia – Altium Ltd. announced the addition of new productivity-enhancing features for its Altium Designer unified electronics development system to assist engineers with handling high-speed design issues.
Altium Designer 6’s intelligent interactive routing system has been enhanced with the addition of a new interactive length-tuning tool specifically for high-speed designs. This new feature reportedly allows designers to quickly optimize and control net lengths by inserting “accordion” segments into a track. Tuning can be manual or rules-driven, and designers can select from several available amplitude styles. This feature is said to combine seamlessly with impedance-controlled, differential pair and multi-trace routing capabilities to give Altium Designer users a comprehensive interactive solution tuned for high-speed, high-density board design projects.
Enhanced control and display over PCB layers will reportedly have more efficient enhanced productivity when moving around large complex designs. The placement and editing of polygons has been streamlined to make the creation of large copper-filled areas fast and intuitive. Improvements have also been made to the way components and libraries are identified and used within the system to deliver greater levels of user control and flexibility. Creating and delivering output for designs that contain embedded board arrays has been improved with added intelligence for identifying layer stackup violations. In addition, enhanced output dialogs for Gerber and ODB++ now reportedly make it even easier for users to make decisions about whether to proceed with output or resolve compatibility violations.