New Products

The QFN package design kit for Agilent’s Advanced Design System electronic design automation software is based on MicroLeadFrame packages. Enables mutual Amkor and Agilent customers to improve RFIC/MMIC design quality and time-to-market. Can explore various design specifications with package information and implement optimized RFIC/MMIC designs. Contains models for 3 x 3, 4 x 4, 5 x 5, and 6 x 6 MLF QFNs. All die are scalable; material properties can be modified. Includes scalable models for bond pad arrays and board via arrays.

Amkor, www.amkor.com

Technistan HTM 4089 is a high throw matte tin sulfate process for printed circuit boards. Additive suppresses deposit thickness on the surface, creating a thicker deposit in the center of a high aspect ratio through-hole or at the bottom of a blind microvia with a fine grain deposit. Provides resistance to final etchants. All components are analyzable and stable. 

Technic, www.technic.com

Engenix v. 3.3.0 engineering automation software for printed circuit board manufacturing is for stackup and traveler automation, job management, communication and collaboration. Integrates CAM, shop floor, and business data. Includes features that center on improving the requirements of rigid-flex circuits, including a stackup editor permitting users to define the final customer product and the manufacturing details required for rigid-flex PCBs; unlimited flex-connector and secondary rigid sections can be added to accommodate complex designs; impedance calculations automatically take into account material changes in the flex sections for transmission lines originating the primary rigid section; optional 3-D graphics are available.

Cimnet, http://cimnet-systems.consona.com/

3-D earth magnetic field sensors, for MEMS test and calibration, can be used for mobile and navigation applications without use of a GPS. Can be combined with low-g accelerometer test. Can be configured with external magnetic coils. Provides high magnetic force at high accuracy.

Multitest, www.multitest.com/MEMS

PP 2793 via plugging paste has a glass transition temperature (Tg) of 155°C and a low coefficient of thermal expansion (CTE).

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DT85M Series 3 Data Logger is for remote monitoring. Features cellular modem. Backlit LCD display shows channel data, alarms, and system status, navigable with six-button keypad. Features temperature operating range of -30°C to 70°C and up to 85% RH. Construction is powder-coated steel and anodized aluminum. Design (peak power 12W) permits use of a smaller solar panel. Enables automatic data delivery. Can send logged data to an FTP server. Internal storage capacity is 128MBs; has removable USB storage device support. Configurable alarm conditions can be used to trigger data delivery and send alarm messages to multiple email addresses or mobile phones. Features 16 analog input channels, expandable up to 320 channels and 960 analog points using optional CEM20 modules, as well as 12 flexible digital channels. Has up to 48 analog sensor inputs with two serial smart sensor ports. Fundamental inputs include voltage, current, resistance and frequency. Supports thermocouples, RTD, thermistors, monolithic temperature sensors, and 4-20mA. Maximum sample speed is 25Hz with 18 bits of effective resolution. Modbus is supported for SCADA connection, as well as multiple SDI-12 interfaces for environmental sensors. dEX graphical interface comes preinstalled.

CAS DataLoggers, www.DataLoggerInc.com

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