May 2007 Cover


High-Speed Design
10+ Gb/second Signal Considerations
Improving layout technique and focusing on physical layer structure can optimize signal integrity.
by Syed W. Ali

Simulation Tools
Software Simulation Tools for EMC Control of High-Speed Signals
Using multiple simulation techniques and tools improves modeling validity.
by Dr. Bruce Archambeault

Innerlayer Copper Considerations
The Impact of Innerlayer Copper Foil Roughness on Signal Integrity
Smooth copper minimizes signal attenuation at high frequencies but it can negatively impact product reliability by reducing innerlayer bond strength.
by Bruce Lee

Innerlayer Bonding
Oxide Replacement for High Temperature Applications
Increased high temperature stability enhances adhesion in RoHS compliant laminate materials.
by Dr. J. Rasmussen, Dr. A. Owei, D. Isik, Dr. A. Dombert and D. Ormerod

Industry Consortia
Can R&D Consortia Increase the PCB Industry's Innovation Output?
Collaborative research provides an economical avenue that fosters process innovation and new product development channels.
by Jack Fisher

CPCA Recap
Moving Forward, Moving Up?
Situated in a new location, CPCA again impresses. But SEMI warns of the threat to China's growth.
by Kathy Nargi-Toth


Our Line
All that glitters: a review of IPC Expo 2007.
Kathy Nargi-Toth

Reduce waste and work towards profitable collaborations that improve your success.
Peter Bigelow

The Flex Market
Revenues post double digit growth on declining volumes.
Dominique Numakura

The Signal Doctor
Understanding differential pairs and differential signals.
Dr. Eric Bogatin



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