Printed Circuit Design & Fab Online Magazine - Products

New Products

Agilent Technologies Inc. introduces Advanced Design System (ADS) 2009 Update 1, the industry’s first complete front-to-back solution for MMIC and RF module design.

The release integrates wireless standards-based design verification libraries, 3D EM analysis, X-Parameter simulation and statistical design and yield optimization.

Designers can stay within the design and simulation platform of choice for the entire design cycle, eliminating the need for separate, time-consuming point tools.

Features include an X-Parameter simulation model generator, delivering fast, drop-in useable and accurate nonlinear behavioral models; integrated planar and 3D EM simulation and analysis, allowing designers to account for EM effects from packages and interconnects without import/export of data or models; and an MMIC layout personality, allowing one-click access to MMIC layout functions.

In addition, designers can interactively modify settings in real time using the Optimization Cockpit.

www.agilent.com

Mentor Graphics Corp. introduces PADS 9.0, allowing designers to employ many of the company’s technologies for design, analysis, manufacturing and multi-disciplined collaboration.

Users can design products from standard to the most complex, highest performance and densest PCBs. Manufacturing and collaboration tools, core design entry and layout enhancements and powerful thermal, signal and power integrity analysis have been added.

Features include a 3D viewer that provides a design’s true 3D representation and the DxDesigner tool that gives a complete system design capability in a single user environment.

Padstack creation has been improved, allowing rounded and chamfered corners, and PADS 9.0 includes new outputs, such as IPC356 netlist and a “flat” DXF file.

Users are able to integrate many of Mentor’s advanced technology offerings, including HyperLynx Analog, I/O Designer, HyperLynx Signal Integrity and Power Integrity, the viseECAD tool and HyperLynx Thermal.

www.mentor.com

Zuken introduces E3.3DRoutingBridge, an interface between MCAD systems and E3.series. Data exchange between 3D Harness Design Systems and E3.series designs are facilitated with a user interface, single installation and added functionality.

The product sends electrical data from E3.series to the mechanical CAD system and then receives structural information. Standard file transfer formats include ASCII, XML or CSV.

www.zuken.com

Fujipoly introduces Zebra Carbon connectors for outdoor LCD applications experiencing extremely low temperature variations.

The LT 200 interconnect device is suitable for a wide range of outdoor LCD applications. It provides a current carrying capacity of 0.050 amps per 0.035-inch by 0.035-inch pad.

The low-resistance connector has alternating layers of non-conductive silicone insulating material and carbon-filled, electrically conductive elastomer with 240 contact pitches per inch. Operating temperatures are from -85° F to 260° F.

www.fujipoly.com

3M introduces the Wrist Strap and Ground Monitor 773, providing effective workstation monitoring in applications having two metal ground requirements.

The monitor is designed for makers of PCBs, defense/aerospace equipment, medical devices and hard disk drives. It grounds and monitors two operators and monitors two metal grounds.

Because it measures ground impedance in automated tools during operation, users can perform immediate corrective actions to improve production yields. Features include real-time communication and an audio alarm, allowing for shut down if impedance values exceed standards.

It is easy to install and inconspicuous on the production floor. The monitor’s measurements are ANSI/ESD S6.1 and ANSI/ESD S20.20 compliant.

www.3M.com

SMSC introduces USB82640 and USB82660 integrated connectivity devices. The single-chip, 2-port USB 2.0 hub controllers are combined with memory card reader functionality.

Users can store and access navigation data and entertainment content directly on solid-state memory cards.

The USB82640 has two downstream USB 2.0 ports and a single Secure Digital/MultimediaCard or Sony MemoryStick memory card interface.

The USB82660 has a second Secure Digital card interface and operates up to an ambient temperature of 105° C. Users can access navigation data and entertainment content simultaneously when stored in memory card formats.
Additional features include: PortMap, allowing flexible port mapping and disable sequences; PortSwap, aligning signal traces directly to connectors; and PHYBoost, allowing programmable transceiver drive strength to help preserve signal integrity in complex system environments.

www.smsc.com