Printed Circuit Design & Fab Online Magazine - Products

New Products

InCAM 2.0 features a third-generation etch compensation algorithm said to run up to five times faster than previous versions, a revised, easy-to-use user interface, automatic impedance line recognition, automatic backdrill creation and analysis, and critical via checks. Improves to signal layer, silk screen and solder mask repair, via optimization and many more DfMs, analysis and editing functions. Enables co-tooling of jobs without user conflicts.

Frontline PCB Solutions, www.frontline-pcb.com

Eleven Lab and Auto Lab include fiducial recognition cameras, full 3-axis control, DesignPro and Design View software. The latter includes a 10 position fully automatic tool changer for unattended operation.

Mits Electronics, www.mitspcb.com

SinkPAD technology for aluminum IMS PCB improves LED thermal management; is for high-power and high-bright surface mount LED systems that can't efficiently dissipate heat. Conducts heat from LED system by enabling a direct thermal path between the LED and surrounding atmosphere; eliminates thermal resistance introduced by dielectric material in a traditional IMS PCB or MCPCB. Reportedly removes the substance with the lowest thermal conductivity/highest thermal resistance from the structure. Isolates dielectric’s metal base electrically and leaves it thermally connected.

SinkPAD, www.sinkpad.com

3D EXT analysis tool is reportedly capable of full wave parasitic extraction of hundreds or thousands of interconnects simultaneously. Supports all types of interconnects, including wire bond, column grid and via arrays, and through silicon vias (TSVs) used in ICs and silicon interposers. Output is standard Touchstone file or RLGC information that can be directly input to Sphinx for Signoff for frequency simulation or converted to Spice with Idem Plus for simulation in any customer preferred spice timing based simulator.

E-System Design, www.e-systemdesign.com

Sphinx for Signoff 64-bit software is a signal and power integrity co-simulator for IC packaging and PCB design. Uses M-FDM methodology. Analyzes complex designs prior to release to production and final signoff for manufacturing. Features include support for DXF, MCM, BRD and SiP file formats; performs quick “what-if analysis” by permitting modification to existing designs; adds capacitor vendors’ libraries; views meshed design before simulation; offers scripting; performs time domain analysis with an integrated flow using Touchstone files converted into robust, passivity and causality conforming spice netlists using IdEM Plus, and incorporates Spice models of complete packages and PCBs for system-level analysis.

E-System Design Inc., www.e-systemdesign.com

3D Forming FPC is a three-dimensional flexible substrate consisting of thermoplastic liquid crystal polymer and copper foil. Withstands reflow temperatures up to 260°C, and has thermal conductivity of 0.5W/m·K, water absorption rate of less than 0.04%, and and dielectric loss tangent of 0.0025.

Nippon Mektron, www.mektron.com