BILLERICA, MA - Orbotech Ltd. has released the PerFix Automated Optical Repair System (AOR), to automatically check PCBs for shorts and excess copper. The company states that the system is the first of its kind in the bare PCB production industry.
According to the company, the use of the new system will greatly reduce the scrapping of PCB panels.
"By automatically fixing short defects which frequently cannot be repaired manually, this solution will enable manufacturers to achieve major operational cost savings, particularly as the complexity of board designs continues to increase." commented Hanan Gino, president of the PCB division at Orbotech.
The company states that the new system employs the image acquisition and processing techniques used in Orbotech's SIP AOI technology, and that the system achieves accurate results not possible with manual repair.
VIENNA, AUSTRIA -- AT&S and Solland Solar, a producer of standard and back-contact solar cells, will cooperate in the development of solar cell and solar module technology.
The development is targeting increased energy efficiency and reduced costs. The objective is to achieve these advantages by using processes and materials that are presently standard to the printed circuit board industry. The companies will produce a functional prototype that will be verified for mass production.
The agreement between AT&S and Solland Solar is solely a development partnership without any equity investments.
HERTFORD, UK - PCB supplier Daleba Electronics has announced an expansion in its Asian operations. The company has created 5 new positions in their manufacturing facilities in Hong Kong and China. The employees speak fluent Mandarin, Cantonese and English.
The company, which also has manufacturing operations in eastern Shenzhen and Guang Dong provinces, has also added a Chinese liaison in the UK to coordinate Hong Kong and Chinese operations. The company states that this will help ensure that communication and correspondence is accurately followed for customers in Europe and Asia.
Andrew Grisbrooke, Director of the TCL Group said, “This recent recruitment drive helps endorse the unique offering that Daleba has for the supply of Far Eastern PCBs, [with] technical and logistical centers in both Hong Kong and China.”
ROMULUS, MI – The right combination of materials, finishes and solders can have a marked effect on bare board cost and reliability.
Indeed, according to Jim Kelch, director of sales/marketing, at PWB fabricator Saturn Electronics Corp.,the right recipe can cut board costs as much as 30%.
In a Webinar Monday, Kelch, along with representatives from Isola Group and Florida CirTech, laid out how. The move to Pb-free creates a host of indirect cost drivers, said Kelch, including increased scrap rate (due to delamination and decreased solderability) and the need for additional storage and handling steps (generally, pre-baking).
The response, according to Kelch, is designers are calling out FR-4 laminates with 180° Tg and 340° Td (time to decomposition at temperature). But while FR-4 is RoHS compliant, it is not always right for Pb-free assembly, he explained, while 180° Tg does not guarantee adequate Td.
Saturn’s proposed solution: mid-grade Pb-free capable laminates that meet IPC-4101/99 (filled) or IPC-4101/124 (unfilled), with a minimum 150° Tg and 325° Td.
The benefits, he says, are a 15 to 20% cost savings on raw materials; lower moisture absorption (0.10 to 0.25%); higher interlaminate adhesion (peel strength = T-288 >10 min.), and high copper-to-laminate peel strength.
Dave Coppens, technical account manager at laminate supplier Isola, discussed test results for the company’s IS400 product, which reportedly performed well under tests for TGA, DSC, Td, weight loss % by TGA, peel strength and 6X reflow.
Next, Glenn Sikorcin, sales manager at Florida CirTech, which is one of the North American licensees for Nihon Superior’s SN100CL, an all-tin solder alloy, shared results of Pb-free HASL and HALT tests. Pb-free HASL required the most energy (G-force and thermal cycling) to break solder joints, and outperformed SnPb HASL in the tests, according Sikorcin. He noted Pb-free HASL (also called HAL) has certain drawbacks, including a non-planar finish, and it’s not ideal for extremely fine-pitch applications; there are post-solderability issues, and SN100CL requires a thermal cycle in addition to thermal cycle in assembly. Finally, no industry standards exist for Pb-free HASL.
Based on Isola and Florida CirTech’s studies, Kelch said, “By implementing one or both solutions, you save up to 30% of bare board cost; increase product performance; standardize fab notes to remove risk of non-performing products, and improve your supply base.”
During the Webinar, Kelch took audience polls. Here are some results:
Have you experienced delamination during Pb-free assembly? – Yes 46% – No 54%
What is your current lead-free finish? – ENIG: 32% – Pb-free HASL: 32% – Immersion silver: 15% – Immersion tin: 0% – RoHS compliant: 21%
