WASHINGTON --The US PTO has issued a patent covering the electrical contact of multiple devices using a flex circuit board.

Read more: US PTO Issues Patent for 'Circuit with Flexible Portion'

ALEXANDRIA, VA -- Six inventors have been issued a US patent for a multilayer electronically isolated thermal conduction structure for a circuit board assembly.

Read more: Patent Issued for MLB Thermal Conduction Structure

SINGAPORE -- FCI Microconnections has opened a 234,000 sq. ft. flex circuit manufacturing facility here, its third in Singapore.

Read more: FCI Opens Massive FPC Mfg Site

BANNOCKBURN, IL – The 2011 Department of Defense Appropriations Bill won’t be finalized until November, leaving in limbo a clause supporting the printed circuit board industry.

The 2011 bill reportedly contains a provision directing the DoD to conduct a defense industrial base assessment of the PCB supply chain. However, despite the delay, some industry-watchers believe the clause ultimately will be included.

The DoD’s increased use of commercial off-the-shelf electronics over the past decade, combined with greater global competition, has led to consolidation in the US printed board industry. Ensuring a continued, secure supply of new technology will require DoD involvement, IPC says. 

The assessment is expected to assist the DoD in ensuring their future electronics requirements are fulfilled, aid in supporting the US printed board industry’s capability to support DoD needs, and further preserve national security.

In a press release, IPC said it expects the Appropriations Bill to be finalized when Congress resumes in November.