FONTENAY-AUX-ROSES, FRANCE – Icape Group has acquired 100% of the assets of Bordan Electronic Consult, a German company specializing in the design of custom-made technical parts.
SHENZHEN -- The board of directors of Shennan Circuits has unanimously approved a major investment to build a printed circuit board fabrication facility in Thailand.
TOKYO – Japanese chip materials maker Resonac plans to set up a research and development center for advanced semiconductor packaging and materials in Silicon Valley.
LOD, ISRAEL – Israel Aerospace Industries has filed a patent for an integrated circuit assembly featuring a base structure with an interposer board and interfacing dies, and a cap structure with an intermediating board and a panel of active elements.
PETACH TIKVA, ISRAEL – Eltek reported revenue of $11.9 million for the third quarter, up 15% over last year's third quarter.
WASHINGTON -- The US Department of Defense today announced an award of $39.9 million via the Defense Production Act Investment (DPAI) Program to Calumet Electronics to enhance capabilities to produce high-density build-up (HDBU) substrates, which include high-density interconnect printed circuit board (PrCB) cores and HDBU build-up layers.