ZURICH – Cicor Group is merging its Cicor Printed Circuit Boards and Cicor Microelectronics divisions into a single unit: Advanced Microelectronics & Substrates. The move comes after Microelectronics has failed to make significant progress over the past two years, the firm says.

Read more: Cicor to Restructure into 2 Divisions

NOTTINGHAM, UK – The 9th International Conference on Additive Manufacturing and 3D Printing requests abstracts focused on process and materials development, design and software developments, supply chain and management issues, and novel applications of additive manufacturing.

Read more: Call for Papers Issued for Additive Manufacturing, 3D Printing Conference

GERLINGEN, GERMANY -- Elekonta Marek and Schweizer Electronic have inked a deal for building prototype PCBs. Under terms of the agreement, Elekonta's prototype customers will be referred to Schweizer for volume production series.

Read more: Elekonta, Schweizer Sign Proto-Volume Partnership Deal

SHENZHEN -- The 2013 International Printed Circuit & APEX South China Fair opened yesterday at the Shenzhen Convention & Exhibition Center, and boosted by the addition of the IPC Apex assembly show, attendance and exhibition space have both set new records.

Read more: HKPCA Show Sets Attendance Registration Mark