Printed Circuit Design & Fab Online Magazine - Fab News

Fab News

TAOYUAN, TAIWAN – Taiwan PCB Techvest saw NT18.9 billion ($596.7 million) in revenue in 2023, a decline of 14% from 2022.

Read more: Taiwan PCB Techvest Sees 14% Revenue Decline

SHENZHEN, CHINA – Shennan Circuit announced 2023 revenue of CNY13.5 billion ($1.9 billion), a decrease of 3.3% from the previous year.

Read more: Shennan Circuit Sees 3% Annual Revenue Decline

ESPOO, FINLAND – Aspocomp announced annual sales of EUR32.3 million ($35.3 million), a decrease of 17% from the previous year's total.

Read more: Aspocomp Sees 17% Decrease in Annual Sales

TAOYUAN, TAIWAN – Zhen Ding Technology announced full-year revenue of NT151.4 billion ($4.8 billion), down 12% from 2022.

Read more: Zhen Ding Announces 12% Drop in Yearly Revenue

TAOYUAN, TAIWAN – Compeq Manufacturing reported a 12% year-over-year decrease in annual revenue, totaling NT67.1 billion ($2.1 billion).

Read more: Compeq Reports 12% Decline in Annual Revenue

TOKYO – Toppan Holdings will build a semiconductor package substrate plant in Singapore, with plans to begin operations at the end of 2026.

Read more: Toppan Plans Singapore Chip Package Substrate Plant

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