Fab News

TOKYO – OKI Circuit Technology has developed multilayer PCB technology with stepped copper coin insertion, which reportedly achieves 55 times better heat dissipation than conventional PCBs.

Read more: OKI Improves Heat Dissipation with Stepped Copper Coin Insertion

VAL-DE-REUIL, FRANCE – Altix, a French specialist in photolithography and direct imaging equipment, has announced its successful merger with MGI Digital Technology.

Read more: Altix Joins MGI Digital Technology Group

ORLANDO, FL – Laser Photonics and its recently-acquired subsidiary, Control Micro Systems, have announced the expansion of their PCB marking technology development program targeting the semiconductor and electronics market.

Read more: Laser Photonics Advances PCB Marking Technology R&D

AUGUSTA, GA -- Nippon Denkai has decided to close and liquidate its copper foil manufacturing plant here, the last such factory in the United States.

Read more: Nippon Denkai to Close Last Remaining US Copper Foil Plant

FONTENAY-AUX-ROSES, FRANCE – Icape Group will acquire a minority shareholding in Jiva Materials, a UK-based developer of what it calls the world's first fully biodegradable PCB substrate.

Read more: Icape Group Acquires Minority Stake in Green PCB Developer

WALTHAM, MA – Nano Dimension announced third quarter revenue of $14.9 million, an increase of 22.1% from last year's third quarter.

Read more: Nano Dimension Reports Record Q3 Results

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