Homepage Slideshow

• Bend Days

  A bend radius lower than the recommended minimum merits a closer look.

  https://www.pcdandf.com/pcdesign/index.php/currenassue/243-flexperts/18757-beyond-the-bend-practical-guidelines-for-flex-and-rigid-flex-design

• The Experts' Take on AI

  What’s working now and what’s not (but should be).

  
  

  https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18760-ai-in-electronics-manufacturing-what-s-working-now-what-s-not-but-should-be

• Are You Using Too Many Vias?

  The answer is probably yes. 

  https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18713-are-you-using-too-many-vias

• Designing for High-Pin Count Devices

  Overcoming “anywhere but here.”

  https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18755-designing-for-high-pin-count-devices

• PCB Stack-up and Signal Integrity Fundamentals

  How to order layers to achieve target impedance values.

  https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18759-fundamentals-of-pcb-stack-up-and-signal-integrity

• Bluetooth Design

  6 steps for limiting interference and data loss.

  https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18758-bluetooth-circuit-board-design-guidelines

• Component Land Patterns

  A manufacturer’s perspective on determining parts layout.

  https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18716-component-land-patterns-a-primer