News

MIDLAND, MI and PHILADELPHIA, PA – The pending Dow Chemical and Rohm and Haas deal looks like it is not going to close by the January 27, 2009 deadline. According to a release from Dow, “unacceptable uncertainties” related to both funding and the performance of the combined companies are key factors. 
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TYNE AND WEAR, ENGLAND – XACT PCB has named David Cheng technical applications engineer. He will be located in Shenzhen, China.
 
Cheng brings many years of experience in PCB manufacturing. Prior to joining XACT, he worked for companies such as Foxconn and Unimicron.

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