News

SOUTH NORWALK, CT -- Cable and connector firm Winchester Electronics has been acquired by private equity firm Snow Phipps for an undisclosed sum. 

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AUSTIN, TX – Fan-out wafer level packaging (FO-WLP) continues to show growth momentum, says TechSearch, with multiple parts found in Samsung’s Galaxy phones and many packages expected in Apple’s next iPhone. Companies are researching large area panel processing as a result of constant pressure to lower cost.

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