News

SUZHOU – Ventec International today announced that the reliability of its polyimide laminates, prepregs and low-flow prepregs has been "conclusively demonstrated" by highly accelerated thermal stress (HATS) testing by two leading PCB manufacturers in Israel.

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BRONSCHHOFEN, SWITZERLAND -- Cicor has launched a new technology platform said to enable high density of integrated functions for printed circuit boards, and at a higher throughput than traditional methods.

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