MORRISVILLE, NC – The International Electronics Manufacturing Initiative (iNEMI) has published the first roadmap topics in its new format, with printed circuit boards, sustainable electronics, smart manufacturing and mmWave materials and test now available online.
GIFU, JAPAN – Ibiden has filed a patent for a printed wiring board featuring an insulating layer, conductor layer, adhesive layer and resin insulating layer, as well as a specific roughness to improve performance.