BOULDER, CO - A University of Colorado at Boulder research center, along with the Lockheed Martin Corp. has won a $1.5 million contract to develop technologies that promise to significantly improve thermal management in electronic devices, a major problem for consumer and military electronic system design.
SMYRNA, GA – UP Media Group, parent company of Circuits Assembly and Printed Circuit Design & Fab, will broadcast "Optimize System Performance with FPGA/PCB Co-Design," a 45-minute free Webinar, on June 3, at 2 PM EDT.