DARMSTADT, GERMANY – Computer Simulation Technology (CST) has announced the winners of the CST University Publication Award. The annual grant rewards university institutes and researchers for work in 3D EM field simulation.
SAN JOSE, CA – The MicroElectronics Packaging and Test Engineering Council in February will sponsor a symposium on semiconductor packaging’s effect on consumer electronics.
The technical event will address packages for consumer products, with session topics including time-to-market and consumer semiconductor packaging; cost-of-ownership challenges for consumer products; solutions for consumer product miniaturization, and advancing technologies for consumer electronics.
It takes place Feb. 19 in San Jose. For more information, visit www.meptec.org.