BEIJING – China's machinery and electronics exports will be up 30% year-over-year in 2010, pushing the country to the top of the world's export ranks, say published reports.
In the first 11 months of the year, China exported $842.7 billion worth of machinery and electronics products, up 32.7% year-over-year, according to the China Chamber of Commerce for Import and Export of Machinery and Electronic Products.
In that period, the total value of imports and exports of machinery and electronics products was $1.4 trillion, up 34.3% compared to the prior year period.
November exports set an all-time high, increasing 34.9% year-over-year to $153.3 billion, and imports rose 37.7% to $130.4 billion.
AUSTIN, TX – The adoption of flip chip and wafer level packaging continues to expand to a wide range of devices, says TechSearch International. The firm projects a compound annual growth rate of more than 15% for flip chip units. In unit volumes, WLPs are expected to see a 12.48% CAGR from 2009 to 2014.
The drivers for flip chip continue to be performance, on-chip power distribution, pad-limited designs, and form factor requirements. The use of FCIP is expanding for microprocessors, ASICs, field programmable gate arrays, DSPs, media devices, chipsets, and graphics chips. Driven by form factor, many wireless products are adopting flip chip interconnect. Solder bumped devices are found in applications such as automotive electronics, computers and peripherals, telecommunications, and consumer products. TechSearch projects strong growth for Cu pillar and 300 mm bumping.
The growth in WLPs is driven by increased demand for thinner, lighter-weight portable products, but WLPs are adopted for form factor, performance and cost-reduction reasons. The industry has seen an increase in shipments of analog devices such as power amplifiers, audio CODEC, integrated power management controllers, ring tones for mobile phones, MOSFETs, image sensors, wireless, and integrated passive devices.
WLPs have historically been used for low-pin-count (≤100 I/O) applications, but many companies plan to use WLPs for higher-pin-count applications with larger die sizes (7 mm x 7 mm or larger), according to the firm.
An increasing number of companies are interested in fan-out WLPs. Fan-out WLPs are a package option for devices with a large number of I/Os that cannot be accommodated by a fan-in design. The use of a fan-out solution provides the same low-profile advantage as the conventional WLP, says TechSearch.
WASHINGTON, DC – Few major OEMs have complete oversight over their supply chains, a new report claims, although whether the firms actually buy conflict minerals was not part of the rankings.
A recent report by the Enough Project ranks 21 top electronics OEMs in terms of how they trace the source of tin, tantalum, tungsten and gold. The report is said to rank firms based on their internal supply chain audits and materials traceability, and grade them for working with trade groups and visiting smelters.
Hewlett-Packard, Intel and Motorola ranked first, second and third, respectively, according to The Globe and Mail, which has seen the unpublished report.
The report found the industry as a whole lacks sufficient internal controls, the paper says, with HP less than 35% complete toward responsible sourcing of conflict minerals, and RIM and Apple less than 15% compliant. Four firms scored 0%, the paper reported.
Per the report, firms were ranked based on their paperwork, not whether they actually buy materials from Congolese mines, however. Metals mined in the Congo have been subject to intense scrutiny by government and non-governmental organizations eager to pressure companies to cease business relationships with companies in the war-ravaged nation.
CAMBRIDGE, MA – Printed electronics is seeing a surge in orders, government and industry-funded development programs, acquisitions and company fundraising, says IDTechEx.
It is now at a “tipping point” because of a sharp improvement in performance, price and repertoire, says the research firm.
The potential market for photovoltaics always was for flexible versions, and now many affordable flexible versions are being commercialized, with printing technology used sooner rather than later to save material and deposition cost, and sometimes to improve performance in various respects, including tolerance of light at narrow angles and damage, according to IDTechEx.
Now solar power can be laminated onto a large dirigible. For example, Northrop Grumman has landed an order for $517 million to make one for surveillance from the upper atmosphere that is based on flexible photovoltaics. Delivery is expected in 2012.
Boeing has won $89 million in funding from the US Defense Advanced Research Projects Agency for the second phase of the Vulture long-endurance unmanned aerial system UAS program based on flexible photovoltaics. Flight testing is expected in 2014.
At the other extreme, new printed organic and dye-sensitized solar cells are selling well this year, both of them in the form of solar bags that charge your phone, says the firm.
Copper indium gallium diSelenide flexible photovoltaics on solar bags is not yet printed, but nanosolar has just put printed versions into production for various applications.
Also, multilayer printed electronics has been designed into some of the new electric cars to be launched in 2011.
Printed transistor circuits are now lower cost than primitive silicon chips such as timers and basic RFID, the research firm notes. Kovio has landed an order for printed nanosilicon day and single trip paper tickets for the Los Angeles Metro, replacing silicon chip versions at potentially one-tenth the cost. Each has more than 1,000 printed transistors in its circuit.
The China National Railway takes three billion of these ISO 14443 tickets yearly, and is also interested in using the printed version.
RFID antennas, membrane keyboards, battery testers on Duracell batteries, and electronic tamper evidence in packages are printed and orders are increasing, adds the firm. Several are at the one billion units a year level already.
The number of printed electronics startups and acquisitions has increased. Chemical company Rhodia has recently joined with Carbon Trust in a $7 million investment in solar energy startup Eight19 to develop printed organic photovoltaic technology. This will use semiconducting organic polymers to provide solar power at a price substantially lower than that offered by first and second-generation technologies. The solar cells will be similar in appearance to photographic films and be flexible, lightweight and easy to install, says IDTechEx.
Heraeus recently bought HC Starck, maker of conductive polymer ink. Bayer bought Artificial Muscle, which prints elastic electrodes on its electroactive polymer film to make haptic touch switches.
Henkel bought part of ICI to acquire conductive ink and other materials. 3M has invested in Printechnologics, which makes entirely printed electronic products, some of which interact with mobile phones. Also, Solvay is moving into printed electronic materials, says IDTechEx.
FRAMINGHAM, MA – Worldwide semiconductor revenues will grow 9% year-over-year in 2011 to $303 billion, and will achieve a CAGR of 6% for the 2010 to 2015 forecast period, according to International Data Corp. Revenues will hit nearly $380 billion by 2015, the firm says.
