LYON, FRANCE – FCBGA package revenue is expected to reach $12 billion by 2025, driven by AI, data center and HPC momentum, according to Yole Développement, a CAGR of 3% between 2020 and 2025.
The majority of wafer demand comes from 3-D stacked devices, with a total wafer CAGR of 8.5% during the forecast period, says the firm. This includes FCBGA, Fan-out, WLCSP, and 3-D stacked packages.
3-D stacked ICs are expected to experience a 24.8% CAGR over the next five years, with HBM accounting for 48% growth, 3-D accounting for 27% and 3-D NAND 82%.
TSMC remains the leader, with 69% market share in 2019 for fan-out packages.
WLCSP packages are getting a strong foothold in the smartphone eco-system.
ASE, JCET, Amkor, and SPIL lead the WLCSP wafer market.