AUSTIN, TX – Starting with shipments of a few 100 million packages in 2015, fan-out wafer level packages show a growth rate of 82% from 2015 to 2020, says TechSearch International.

In addition, fan-in WLPs are projected to have a 10% growth rate during the five-year period. This growth is driven by demand for thin, low-profile packages in smartphones, tablets, and wearable devices.

The use of FO-WLP for RF, audio CODEC, and power management ICs, coupled with Apple’s adoption of TSMC’s InFO FO-WLP as the bottom package-on-package in Apple’s iPhone 7, is driving unit volume shipments. Automotive radar, connectivity modules, and other applications promise continued growth for FO-WLPs.

Cost-reduction pressures are driving the development of alternatives to reconstituted wafer FO-WLP in the form of large area panel processing and flip chip on coreless or thin core substrates.

Driven by small size devices such as filters, low noise amplifiers, power amplifiers, and switches found in smartphones, flip chip growth
shows a 13% CAGR in unit volume from 2015 to 2020.

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