Printed Circuit Design & Fab Online Magazine - Fab News

Fab News

Details: Written by Staff; Category: Fab News; Published: 06 September 2007

DALLAS — Titan Global Holdings, parent company of Titan Electronics, today forecast fiscal 2008 sales of $747 million, about $30 million of which would come from its PWB manfuacturing operations.

Details: Written by Staff; Category: Fab News; Published: 05 September 2007

LARGO, FL -- Bare Board Group Inc., a distributor of printed circuit boards, was named to Inc. Magazine's latest list of the 5,000 fastest-growing private companies in the U.S.

BBG, a five-year-old firm that procures bare PCBs, had a whopping 153% increase in sales in the past three years. That was good for no. 2309 on the list.

“We are ecstatic to be recognized on a national level. Everyone has worked hard, and this verifies our successful business model,” says BBG President Greg Papandrew.

Details: Written by Staff; Category: Fab News; Published: 04 September 2007

CITY OF INDUSTRY, CA -- Automa-Tech Advanced Technologies will merge with its branch company, ORC Imaging Corp., the companies said today. Under the new structure, the company's UV exposure products will be marketed under the name Automatech-ORCi.

Details: Written by Staff; Category: Fab News; Published: 31 August 2007

BANNOCKBURN, IL – The IPC spent $140,000 in lobbying expenses during the first six months of 2007, according to a disclosure form. Read more ...

REHOVOTH, ISRAEL – Printar Ltd., a manufacturer of digital printing equipment, has named Arie Rosenfeld chairman of the board.

Rosenfeld is managing partner of Dor Ventures, one of Printar’s shareholders. He has served on the board since mid 2006. He has also served as chairman of XAAR in Cambridge, U.K. and is a strategic consultant to Dainippon Screen Ltd.

From 1988 to 1995, Rosenfeld was president and CEO of Scitex Corp. Ltd. During this period, the company’s revenue grew fourfold to $750 million.

Rosenfeld replaces Koby Rosenthal, who stepped down following his departure from D-Partners fund.

ROGERS, Conn.- Rogers Corporation announced the company has licensed a highly compliant thermal interface material technology from International Business Machines (IBM). This technology is used in high performance and high reliability chip packaging applications where heat management becomes a limiting factor. Rogers plans to integrate this product line into its Thermal Management Solutions family of products.

Robert C. Daigle, Rogers Vice President of R&D and Chief Technology Officer, stated, "We are pleased to add this technology to our thermal management portfolio. Products based on this technology will become an essential part of Rogers's strategy of being a solutions provider for our thermal management customers. While searching for thermal interface material technologies, it became clear that IBM had developed a truly unique, high performance material set and we feel confident we can turn this into a commercial success."