Fab News

U.S. and SOUTH KOREA - A technique that uses a combination of maintaining a layer of water on a work surface while firing a laser in nanosecond pulses could aid in the processing of metals.

Using a thin layer of water on a metal sample when using a laser reportedly results in more efficient processing when compared with dry conditions, according to a team from the U.S. and South Korea. The researchers found that keeping a layer of water on the surface increased the material removal rate by up to eight times, while causing minimal damage to the peripheral regions, as reported in the Journal of Applied Physics.

"We found that laser-metal processing was enhanced especially at the low ablation threshold thanks to the mechanical impact of water," said researcher Hyun Wook Kang of American Medical Systems. "The layer of water generated high pressure impact during vaporization as well as removed laser-induced material debris to effectively deliver laser energy."
BANNOCKBURN, IL. - The IPC has released its findings for April's monthly North American Printed Circuit Board (PCB) Statistical Program.

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SOUTH PLAINFIELD, NJ ― R&D Circuits has announced the appointment of Michael W. Bivens to its sales team.

Bivens will have direct sales responsibilities in the mountain states region, managing accounts and assisting with applications and product integration.

“R&D Circuits is continuing on a growth pattern and the need for additional applications experts led us to Mike. As we continue to expand our presence in the region, it was becoming apparent we needed to be able to support our customer base locally,” said James Russell, president.

Biven’s previous experience includes positions with Dynamic Test Solutions as a regional account manager, as well as companies including Intel, Probe Technology and Microprobe.
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USA, ASIA - PC and electronics vendors including Dell, HP, Samsung and Sony have all requested that copper clad laminate (CCL) manufacturers begin incorporating lead- and halogen-free materials into component production.

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BANGALORE, INDIA – The Indian Printed Circuit Association (IPCA) will form a partnership with Messe München International to produce electronicIndia 2008, at the Bangalore International Exhibition Center from September 2 to 5.

The agreement was signed by Manmeet Sabarwal, managing director of MMI India Pvt. and Anil Kumar, chairman of the IPCA executive committee. Messe München will organize the event, and is working to attract 100 exhibitors to the show.

Previously a trade show for the Indian PCB industry, the IPCA Expo will now be integrated into electronicIndia 2008 and housed in a separate pavilion. The show will feature technical seminars on EMS, automobile electronics and PCB technologies, and certification programs by the Electronics Designer Council of India. A meeting of the World Electronics Circuits Council (WECC) is also planned.

The organizers are expecting 20,000 visitors and business delegations from Germany, Singapore, China, Hong Kong, Taiwan, Japan, the USA and Europe.

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