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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

  • Flex Shock and Vibration

    Flex Shock and Vibration

    PSAs and carefully chosen connectors can reduce the shock of intense conditions.  READ MORE...

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Fab News

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Category: Fab News
SHANGHAI - The electronics industry descended on Shanghai this week as four major exhibitions staged a convergence of programs.

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MILPITAS, CA - Flex Interconnect Technologies (FIT) announced that its Quality Management System is certified to AS9100 revision B standards. The AS9100 revision B is a standard developed by International Aerospace Quality Group (IAQC).
 
The certification was granted after an audit by Intertek Systems, one of the most reputed registrars of aerospace standards. Flex Technologies reportedly passed the audit with a perfect 100% score.
 
“Getting AS9100 certification is a great achievement, and puts us amongst a select few PCB companies in the world with such certification,” said FIT president Chetan Shah.  “It demonstrates our commitment to quality and on-time delivery, and solidifies our place as a world class manufacturer for the Aerospace and Defense industries.”

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PORTLAND, OR - Electro Scientific Industries (ESI) announced that Korea’s largest multi-layer ceramic capacitor (MLCC) array producer has placed an order for six of the company's Model 3400 Multi-function Test systems. The 3400 systems will be used to expand the customer’s production capacity for small MLCC arrays used in cell phones and other hand-held devices.

ESI product marketing manager Vernon Cooke, said, “This multi-system order…represents a key competitive win that strengthens ESI’s position as the premier provider of MLCC test equipment worldwide."

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Category: Fab News
ROGERS, CT - The Rogers Corporation will feature several of its products from its advanced circuit materials line at the 2008 IPC Printed Circuits Expo, APEX and the Designers Summit in Las Vegas at booth 1028, from April 1 to 3.
 
Rogers will showcase its RT/duroid 6202PR as well as its RO4000 series of high-frequency circuit materials and R/flex 8080 liquid photoimageable covercoats.  These products are used in a variety of high frequency applications, including advanced packaging, wireless and high speed digital markets.

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