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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

  • Flex Shock and Vibration

    Flex Shock and Vibration

    PSAs and carefully chosen connectors can reduce the shock of intense conditions.  READ MORE...

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Fab News

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Category: Fab News

TAIPEI -- Foxconn's momentum at the end of 2014 is carrying over to 2015. 

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TOKYO -- OKI Printed Circuits has built what it is calling the world’s-first mass-production technology for "super multilayer" printed circuit boards of 102 layers apiece.

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MULINO, OR – Sunstone Circuits today announced discounts on printed circuit boards orders of five and 10 business day lead times.

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TAIPEI -- Zhen Ding Technology reported fourth-quarter revenues of NT$25.83 billion ($820 million), up 34.6% sequentially.

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BANNOCKBURN, IL — Total North American PCB shipments fell 2% year-over-year in January and the 90-day average bookings were off 2.9%.

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SAN DIEGO – Three long-time IPC volunteers were presented with IPC President's Awards at IPC Apex Expo here.

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