WASHINGTON -- By challenging the technology community to integrate the collective functions hosted by an entire PCB onto a device approaching the size of a single chip, DARPA’s newest program is making a bid to usher in a fresh dimension of technology miniaturization.

SOUTH NORWALK, CT -- Cable and connector firm Winchester Electronics has been acquired by private equity firm Snow Phipps for an undisclosed sum. 

AUSTIN, TX – Fan-out wafer level packaging (FO-WLP) continues to show growth momentum, says TechSearch, with multiple parts found in Samsung’s Galaxy phones and many packages expected in Apple’s next iPhone. Companies are researching large area panel processing as a result of constant pressure to lower cost.

SUZHOU, CHINA – Seica Electronics has doubled its local technical support team in the first half and expects to expand further in the near future.