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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

  • Flex Shock and Vibration

    Flex Shock and Vibration

    PSAs and carefully chosen connectors can reduce the shock of intense conditions.  READ MORE...

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Fab News

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Category: Fab News

SAN JOSE, CA – The Silicon Valley Chapter of the IPC Designers Council is meeting at TTM here Oct. 13 to discuss printed circuit board cost adders.

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WASHINGTON – The International Trade Commission has instituted an investigation to determine whether imports of memory modules are violating Section 337 of the 1930 Tariff Act by reason of patent infringement.

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LAKE TAHOE, CA – EOS/ESDA is soliciting abstracts for the 11th annual International Electrostatic Discharge Workshop, which takes place here May 7-11.

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HONG KONG -- Automation and even "lights out" PCB manufacturing are among the themes of the upcoming HKPCA Show.

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WASHINGTON -- The US Department of Defense has issued its response to public comments to a pending rule regarding cybersecurity at its contractors.

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BANNOCKBURN, IL – A host of industry volunteers were recognized for their contributions at IPC's fall meetings this week.

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