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Fab News

Details: Written by Staff; Category: Fab News; Published: 08 April 2008

Details: Written by Staff; Category: Fab News; Published: 07 April 2008

GLASGOW, SCOTLAND - Teknek has increased its US presence by reaching a distributor agreement with West Coast based Technica and East Coast based Atlantech. These two companies will assume responsibility for the Teknek product line within the electronics market.

Teknek produces contact cleaning equipment for a claimed increase in manufacturing yield by reducing waste by removing contamination from the production process.

Stephen Mitchell, Teknek CEO said, "We have had a good working relationship with Technica for many years. Now that Technica has a strong East Coast partner in Atlantech and… made sense to formalize the arrangement and let them sell our product alongside it."

Details: Written by Staff; Category: Fab News; Published: 01 April 2008

TAIWAN - Yeu Hwan Technology's second quarter performance improved on increased orders in both the flexible and traditional PCB segments.

Yeu Hwan reported that it expects its second-quarter sales grow 25% to over $11.6 million, after losses to its FPCB business over the past two years. With a recent validation for its FPCB products by a new customer, the company reports that it anticipates shipments will increase in April, projecting a profit in the second quarter.

Losses in the FPCB segment prompted Yeu Hwan to begin the manufacture of rigid-flex PCBs, and the company reports that for 2008, it expects half of its sales will be in the rigid-flex PCB segment.

TAIWAN – Copper Clad Laminate (CCL) manufacturers in Taiwan are said to be considering a 5% to 10% price increase in April, due to rising copper costs.

HAMPSHIRE, UK - CEMCO FSL announced that Stevenage Circuits, Hertfordshire UK, have ordered a "Streamline" Conveyorized Immersion System for use with MEC Etch Bond chemistry.

According to CEMCO FSL this new generation of wet process equipment is designed using unique laminar or "Streamline" flow treatment chamber that replace conventional flood and spray chambers reducing the equipment footprint and improving chemistry function.

The system is scheduled for delivery May 2008.