CARLSBAD, CA — The US Patent and Trademark Office has granted eSurface Technologies a pair of patents covering the areas of surface activation and metalization. 

The patents relate to the proprietary method for the metalization of a nonconductive surface.

The new patents cover a process for eliminating toxic waste generated by conventional manufacturing methods, and permitting conductive material to be embedded in surfaces that can receive an image.

eSurface is licensing the process to printed circuit board manufacturers. 

"We are pleased with the recent grants of these two patent applications and look forward to many others as our company continues to mature and grow into a leader within the technology sector,” said Dr. William Wismann, eSurface executive vice president and chief technology officer. “Receiving a patent encompassing your core technology is validation you are taking an approach unique to the market.”

The patents numbers are 8,784,952 and 8,784,953.

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