Log in / Register
Account Login
Register
  • Forgot Username?
  • Forgot Password?
  • What is Ultra HDI?

    What is Ultra HDI?

    With Ultra HDI, small features come with big decisions.  READ MORE...

  • The Critical Nature of PCB Stackup

    The Critical Nature of PCB Stackup

    The stackup supports every layer above it.  READ MORE...

  • The PCB Design Review Process

    The PCB Design Review Process

    A structured design review process ensures alignment.  READ MORE...

  • Metal-Core PCBs and Thermal Management

    Metal-Core PCBs and Thermal Management

    Catch heat at the board.  READ MORE...

Homepage Slideshow

  • What is Ultra HDI?

    With Ultra HDI, small features come with big decisions.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19043-ultra-hdi-what-is-it-and-how-is-it-different-than-hdi

  • The Critical Nature of PCB Stackup

    The stackup supports every layer above it.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19042-the-critical-nature-of-pcb-stackup-and-how-to-build-an-efficient-one

  • The PCB Design Review Process

    A structured design review process ensures alignment.

    https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/19037-reviewing-the-pcb-design-review-process

  • Metal-Core PCBs and Thermal Management

    Catch heat at the board.

    https://pcdandf.com/pcdesign/index.php/current-issue/293-board-talk/19039-metal-core-pcbs-and-thermal-management

  • HOME
  • Advertising
    • Sales Contacts
    • Media Kit
  • .
  • Education
    • Archives
    • News
      • Design News
      • Fab News
      • Market News
    • New Products
    • Features
    • The Route: Printed Circuit Engineering Association News
    • Editorial Contributions
    • NPI Award
    • CIRCUITS ASSEMBLY Magazine
    • White Papers/e-Books
    • Hall of Fame
    • Printed Circuit University
  • Research
    • Market Data
    • NTI-100
    • PCB Design History
    • CAD/CAM/PCB Software Providers
    • PCB Design Engineer Salary Surveys
  • .
  • PCB Update
  • .
  • Events
    • PCB West
    • Industry Events
    • PCB2Day Workshop Series
    • PCB East
  • .
  • Subscribe
  • .
  • Search
  • Home
  • Education
  • News
  • Fab News
  • Isola, Park Electrochemical Settle Patent Dispute

EPA Begins Cleanup of Former Ozark Circuits

Published: 22 August 2013
 by Staff

SPRINGFIELD, MO -- Cleanup of toxic materials left in the wake of the 2011 bankruptcy of Ozark Circuits has begun, according to published reports.

The US EPA is coordinating the remediation and removal of some 3,000 gallons of plating and other waste chemistries. The cleanup of the former printed circuit board fabrication site is expected to take about two months.

Rati Patel, the former owner, filed for bankruptcy in 2011.

  • Prev
  • Next
Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article
MARCH ISSUE
February cover

View the Digital
Edition Here!

POPULAR

  • The Victory Plan Reborn: Forcing the Surge of America’s Drone Industrial Base
  • The Via Revolution: Stacked, Staggered and Copper-Filled
  • Adhesive vs. Adhesiveless Polyimide Core Materials Used in Flex and Rigid-Flex Applications
  • Experimental Evaluation of High-Thermal Dielectric Materials and Surface-Mount Thermal Bridges in Multilayer PCB Designs
  • The Critical Nature of PCB Stackup, and How to Build an Efficient One

Press Releases

  • Global Tablet Shipments Decline 3% QoQ in Q4 2025 as Market Matures
  • Schmid Group Secures Major Order for Wet-Process Production Equipment Supporting AI- and HPC-Infrastructure
  • AdvancedPCB Promotes Industry Veteran John Stine to Chief Technology Officer
  • Future Electronics and SnapMagic Announce CAD Model Integration to Support Faster Design Cycles
  • News
  • .
  • Products
  • .
  • Contacts
  • .
  • PCB Chat
  • .
  • Login

ISSN 1939-5442, Copyright © 2026 Printed Circuit Engineering Association®, PO Box 237 Portsmouth, NH 03802. All rights reserved. This website contains copyrighted material that cannot be reproduced without permission. Printed Circuit Engineering Association® Privacy Policy