Printed Circuit Design & Fab Online Magazine - Aschenbrenner Wins Pan Pac Symposium Best Presentation

ENEPIG Corrosion Mechanisms
Different types of nickel corrosion and potential mitigation strategies.
READ MORE...
The Future is Thin, Flat and Flexible
What’s ahead for antennas, heaters and inks.
READ MORE...
Royalty Flush
A noted solutions architect offers an audacious plan for AI acceptance. It just might work.
READ MORE...
Rocking and Rolling at ZIW
The annual user event was tuned into AI, but that’s not the only melody being played.
READ MORE...
Can Thailand Pad its PCB Gains?
2023 saw only a handful of fabricators gain ground, but SE Asia is primed to boom.
READ MORE...

Printed Circuit Design & Fab Magazine

MAUI – The 2013 Pan Pacific Symposium Best Presentation Award went to Rolf Aschenbrenner, Ph.D., in a vote by attendees of the January conference.

Aschenbrenner, a researcher with the Fraunhofer Institute for Reliability and Microintegration, delivered a paper titled “Panel Level Packaging - A Manufacturing Solution for Cost Effective Systems.”

Next year's symposium will be held Feb. 11-13, 2014, at the Hapuna Beach Prince Resort on the Big Island of Hawaii. The call for papers will be posted on www.smta.org/panpac in early March.

For more information, contact JoAnn Stromberg at This email address is being protected from spambots. You need JavaScript enabled to view it..

NOVEMBER ISSUE

View the Digital
Edition Here!

Aschenbrenner Wins Pan Pac Symposium Best Presentation

POPULAR

Press Releases